Please use this identifier to cite or link to this item: http://localhost/handle/Hannan/607210
Title: Low-Loss 3-D Multilayer Transmission Lines and Interconnects Fabricated by Additive Manufacturing Technologies
Authors: Fan Cai;Yung-Hang Chang;Kan Wang;Chuck Zhang;Ben Wang;John Papapolymerou
subject: vertical interconnects|3-D printing|stripline (SL)|multilayer|via|Aerosol jet printing (AJP)|millimeter (mm)wave
Year: 2016
Publisher: IEEE
Abstract: This paper presents low-loss 3-D transmission lines and vertical interconnects fabricated by aerosol jet printing (AJP) which is an additive manufacturing technology. AJP stacks up multiple layers with minimum feature size as small as 20 μm in the xy-direction and 0.7 μm in the z-direction. It also solves the problem of fabricating vias to realize the vertical transition by 3-D printing. The loss of the stripline is measured to be 0.53 dB/mm at 40 GHz. The vertical transition achieves a broadband bandwidth from 0.1 to 40 GHz. The results of this paper demonstrate the feasibility of utilizing 3-D printing for low-cost multilayer system-on-package RF/millimeter-wave front-ends.
URI: http://localhost/handle/Hannan/139369
http://localhost/handle/Hannan/607210
ISSN: 0018-9480
1557-9670
volume: 64
issue: 10
Appears in Collections:2016

Files in This Item:
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Title: Low-Loss 3-D Multilayer Transmission Lines and Interconnects Fabricated by Additive Manufacturing Technologies
Authors: Fan Cai;Yung-Hang Chang;Kan Wang;Chuck Zhang;Ben Wang;John Papapolymerou
subject: vertical interconnects|3-D printing|stripline (SL)|multilayer|via|Aerosol jet printing (AJP)|millimeter (mm)wave
Year: 2016
Publisher: IEEE
Abstract: This paper presents low-loss 3-D transmission lines and vertical interconnects fabricated by aerosol jet printing (AJP) which is an additive manufacturing technology. AJP stacks up multiple layers with minimum feature size as small as 20 μm in the xy-direction and 0.7 μm in the z-direction. It also solves the problem of fabricating vias to realize the vertical transition by 3-D printing. The loss of the stripline is measured to be 0.53 dB/mm at 40 GHz. The vertical transition achieves a broadband bandwidth from 0.1 to 40 GHz. The results of this paper demonstrate the feasibility of utilizing 3-D printing for low-cost multilayer system-on-package RF/millimeter-wave front-ends.
URI: http://localhost/handle/Hannan/139369
http://localhost/handle/Hannan/607210
ISSN: 0018-9480
1557-9670
volume: 64
issue: 10
Appears in Collections:2016

Files in This Item:
File Description SizeFormat 
7560640.pdf2.28 MBAdobe PDFThumbnail
Preview File
Title: Low-Loss 3-D Multilayer Transmission Lines and Interconnects Fabricated by Additive Manufacturing Technologies
Authors: Fan Cai;Yung-Hang Chang;Kan Wang;Chuck Zhang;Ben Wang;John Papapolymerou
subject: vertical interconnects|3-D printing|stripline (SL)|multilayer|via|Aerosol jet printing (AJP)|millimeter (mm)wave
Year: 2016
Publisher: IEEE
Abstract: This paper presents low-loss 3-D transmission lines and vertical interconnects fabricated by aerosol jet printing (AJP) which is an additive manufacturing technology. AJP stacks up multiple layers with minimum feature size as small as 20 μm in the xy-direction and 0.7 μm in the z-direction. It also solves the problem of fabricating vias to realize the vertical transition by 3-D printing. The loss of the stripline is measured to be 0.53 dB/mm at 40 GHz. The vertical transition achieves a broadband bandwidth from 0.1 to 40 GHz. The results of this paper demonstrate the feasibility of utilizing 3-D printing for low-cost multilayer system-on-package RF/millimeter-wave front-ends.
URI: http://localhost/handle/Hannan/139369
http://localhost/handle/Hannan/607210
ISSN: 0018-9480
1557-9670
volume: 64
issue: 10
Appears in Collections:2016

Files in This Item:
File Description SizeFormat 
7560640.pdf2.28 MBAdobe PDFThumbnail
Preview File