Please use this identifier to cite or link to this item: http://localhost/handle/Hannan/603960
Title: High-Frequency Analysis of Cu-Carbon Nanotube Composite Through-Silicon Vias
Authors: Wen-Sheng Zhao;Jie Zheng;Yue Hu;Shilei Sun;Gaofeng Wang;Linxi Dong;Liyang Yu;Lingling Sun;Wen-Yan Yin
subject: Cu-CNT composite TSV|carbon nanotube (CNT)|effective complex conductivity|Through-silicon via (TSV)
Year: 2016
Publisher: IEEE
Abstract: A high-frequency analysis of Cu-carbon nanotube (CNT) composite through-silicon vias (TSVs) is conducted. The electrical modeling of the Cu-CNT composite TSVs is performed, with the effective complex conductivity formulated for accurate characterization of kinetic inductance. It is shown that, after codepositing CNT with Cu, the electrical conductivity of the TSVs can be improved and the influence of kinetic inductance variation can be suppressed in comparison with the CNT TSVs. On the other hand, the Cu-CNT composite TSVs can exhibit little compromise in performance yet much enhanced reliability by comparison to the Cu counterpart. That is, the Cu-CNT composite TSVs can provide a better tradeoff between reliability and performance than the Cu and CNT counterparts.
URI: http://localhost/handle/Hannan/138532
http://localhost/handle/Hannan/603960
ISSN: 1536-125X
1941-0085
volume: 15
issue: 3
Appears in Collections:2016

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Title: High-Frequency Analysis of Cu-Carbon Nanotube Composite Through-Silicon Vias
Authors: Wen-Sheng Zhao;Jie Zheng;Yue Hu;Shilei Sun;Gaofeng Wang;Linxi Dong;Liyang Yu;Lingling Sun;Wen-Yan Yin
subject: Cu-CNT composite TSV|carbon nanotube (CNT)|effective complex conductivity|Through-silicon via (TSV)
Year: 2016
Publisher: IEEE
Abstract: A high-frequency analysis of Cu-carbon nanotube (CNT) composite through-silicon vias (TSVs) is conducted. The electrical modeling of the Cu-CNT composite TSVs is performed, with the effective complex conductivity formulated for accurate characterization of kinetic inductance. It is shown that, after codepositing CNT with Cu, the electrical conductivity of the TSVs can be improved and the influence of kinetic inductance variation can be suppressed in comparison with the CNT TSVs. On the other hand, the Cu-CNT composite TSVs can exhibit little compromise in performance yet much enhanced reliability by comparison to the Cu counterpart. That is, the Cu-CNT composite TSVs can provide a better tradeoff between reliability and performance than the Cu and CNT counterparts.
URI: http://localhost/handle/Hannan/138532
http://localhost/handle/Hannan/603960
ISSN: 1536-125X
1941-0085
volume: 15
issue: 3
Appears in Collections:2016

Files in This Item:
File Description SizeFormat 
7442879.pdf811.78 kBAdobe PDFThumbnail
Preview File
Title: High-Frequency Analysis of Cu-Carbon Nanotube Composite Through-Silicon Vias
Authors: Wen-Sheng Zhao;Jie Zheng;Yue Hu;Shilei Sun;Gaofeng Wang;Linxi Dong;Liyang Yu;Lingling Sun;Wen-Yan Yin
subject: Cu-CNT composite TSV|carbon nanotube (CNT)|effective complex conductivity|Through-silicon via (TSV)
Year: 2016
Publisher: IEEE
Abstract: A high-frequency analysis of Cu-carbon nanotube (CNT) composite through-silicon vias (TSVs) is conducted. The electrical modeling of the Cu-CNT composite TSVs is performed, with the effective complex conductivity formulated for accurate characterization of kinetic inductance. It is shown that, after codepositing CNT with Cu, the electrical conductivity of the TSVs can be improved and the influence of kinetic inductance variation can be suppressed in comparison with the CNT TSVs. On the other hand, the Cu-CNT composite TSVs can exhibit little compromise in performance yet much enhanced reliability by comparison to the Cu counterpart. That is, the Cu-CNT composite TSVs can provide a better tradeoff between reliability and performance than the Cu and CNT counterparts.
URI: http://localhost/handle/Hannan/138532
http://localhost/handle/Hannan/603960
ISSN: 1536-125X
1941-0085
volume: 15
issue: 3
Appears in Collections:2016

Files in This Item:
File Description SizeFormat 
7442879.pdf811.78 kBAdobe PDFThumbnail
Preview File