Please use this identifier to cite or link to this item: http://localhost/handle/Hannan/505595
Title: Development of a New Insulation Approach for the LHC Main 13 kA Interconnection Splices
Authors: Lackner, F;Bertinelli, F;Fessia, P;Lopez, R;Prin, H;Tock, J Ph
subject: Science & Technology
Year: 2012
Publisher: Ieee
Description: 


URI: http://localhost/handle/Hannan/319636
http://localhost/handle/Hannan/505595
Appears in Collections:2012

Files in This Item:
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AL1973366.pdf478.49 kBAdobe PDF
Title: Development of a New Insulation Approach for the LHC Main 13 kA Interconnection Splices
Authors: Lackner, F;Bertinelli, F;Fessia, P;Lopez, R;Prin, H;Tock, J Ph
subject: Science & Technology
Year: 2012
Publisher: Ieee
Description: 


URI: http://localhost/handle/Hannan/319636
http://localhost/handle/Hannan/505595
Appears in Collections:2012

Files in This Item:
File SizeFormat 
AL1973366.pdf478.49 kBAdobe PDF
Title: Development of a New Insulation Approach for the LHC Main 13 kA Interconnection Splices
Authors: Lackner, F;Bertinelli, F;Fessia, P;Lopez, R;Prin, H;Tock, J Ph
subject: Science & Technology
Year: 2012
Publisher: Ieee
Description: 


URI: http://localhost/handle/Hannan/319636
http://localhost/handle/Hannan/505595
Appears in Collections:2012

Files in This Item:
File SizeFormat 
AL1973366.pdf478.49 kBAdobe PDF