Please use this identifier to cite or link to this item: http://localhost/handle/Hannan/227317
Title: Investigation of Copper&x2013;Carbon Nanotube Composites as Global VLSI Interconnects
Authors: Zi-Han Cheng;Wen-Sheng Zhao;Linxi Dong;Jing Wang;Peng Zhao;Haijun Gao;Gaofeng Wang
Year: 2017
Publisher: IEEE
Abstract: Applicability of copper&x2013;carbon nanotube (Cu-CNT) composites as on-chip global VLSI interconnects is investigated comprehensively. Electrical modeling of Cu-CNT composite interconnects is carried out by virtue of effective complex conductivity. The performances, including time delay and step response, are characterized based on the equivalent circuit model. Finally, the crosstalk effect between coupled Cu-CNT composite interconnects is analyzed.
URI: http://localhost/handle/Hannan/227317
volume: 16
issue: 6
More Information: 891,
900
Appears in Collections:2017

Files in This Item:
File SizeFormat 
8081789.pdf1.75 MBAdobe PDF
Title: Investigation of Copper&x2013;Carbon Nanotube Composites as Global VLSI Interconnects
Authors: Zi-Han Cheng;Wen-Sheng Zhao;Linxi Dong;Jing Wang;Peng Zhao;Haijun Gao;Gaofeng Wang
Year: 2017
Publisher: IEEE
Abstract: Applicability of copper&x2013;carbon nanotube (Cu-CNT) composites as on-chip global VLSI interconnects is investigated comprehensively. Electrical modeling of Cu-CNT composite interconnects is carried out by virtue of effective complex conductivity. The performances, including time delay and step response, are characterized based on the equivalent circuit model. Finally, the crosstalk effect between coupled Cu-CNT composite interconnects is analyzed.
URI: http://localhost/handle/Hannan/227317
volume: 16
issue: 6
More Information: 891,
900
Appears in Collections:2017

Files in This Item:
File SizeFormat 
8081789.pdf1.75 MBAdobe PDF
Title: Investigation of Copper&x2013;Carbon Nanotube Composites as Global VLSI Interconnects
Authors: Zi-Han Cheng;Wen-Sheng Zhao;Linxi Dong;Jing Wang;Peng Zhao;Haijun Gao;Gaofeng Wang
Year: 2017
Publisher: IEEE
Abstract: Applicability of copper&x2013;carbon nanotube (Cu-CNT) composites as on-chip global VLSI interconnects is investigated comprehensively. Electrical modeling of Cu-CNT composite interconnects is carried out by virtue of effective complex conductivity. The performances, including time delay and step response, are characterized based on the equivalent circuit model. Finally, the crosstalk effect between coupled Cu-CNT composite interconnects is analyzed.
URI: http://localhost/handle/Hannan/227317
volume: 16
issue: 6
More Information: 891,
900
Appears in Collections:2017

Files in This Item:
File SizeFormat 
8081789.pdf1.75 MBAdobe PDF