Please use this identifier to cite or link to this item: http://localhost/handle/Hannan/207806
Title: A Compact Ka-Band Active Integrated Antenna With a GaAs Amplifier in a Ceramic Package
Authors: Yexi Song;Yunqiu Wu;Jie Yang;Yin Tian;Wei Tong;Yijun Chen;Cetian Wang;Xiaohong Tang;Johannes Benedikt;Kai Kang
Year: 2017
Publisher: IEEE
Abstract: This letter presents the design of a Ka-band active integrated antenna in package (AIAiP). A monolithic microwave integrated circuit amplifier based on the GaAs process and a compact patch antenna based on the printed circuit board process are implemented, respectively. Then, the amplifier and antenna are assembled together in a specified package using the wire-bond process. Thus, compared to the traditional solutions, the transmission loss and the size of the proposed AIAiP are significantly reduced. Furthermore, the influence of the bonding wire and the package is taken into account in the design of the amplifier and the antenna, respectively. A good agreement between the simulation and measurement results can be observed. The proposed AIAiP occupies a compact size of 7 &x00D7; 7 mm<sup>2</sup>. Meanwhile, it achieves -10-dB impedance bandwidth from 33.4 to 37.2 GHz and a peak gain of 18.9 dBi at 35 GHz. Additionally, the impact of the package size on the antenna performance has been demonstrated for future AIA designers.
Description: 
URI: http://localhost/handle/Hannan/207806
volume: 16
More Information: 2416,
2419
Appears in Collections:2017

Files in This Item:
File SizeFormat 
7964664.pdf754.02 kBAdobe PDF
Title: A Compact Ka-Band Active Integrated Antenna With a GaAs Amplifier in a Ceramic Package
Authors: Yexi Song;Yunqiu Wu;Jie Yang;Yin Tian;Wei Tong;Yijun Chen;Cetian Wang;Xiaohong Tang;Johannes Benedikt;Kai Kang
Year: 2017
Publisher: IEEE
Abstract: This letter presents the design of a Ka-band active integrated antenna in package (AIAiP). A monolithic microwave integrated circuit amplifier based on the GaAs process and a compact patch antenna based on the printed circuit board process are implemented, respectively. Then, the amplifier and antenna are assembled together in a specified package using the wire-bond process. Thus, compared to the traditional solutions, the transmission loss and the size of the proposed AIAiP are significantly reduced. Furthermore, the influence of the bonding wire and the package is taken into account in the design of the amplifier and the antenna, respectively. A good agreement between the simulation and measurement results can be observed. The proposed AIAiP occupies a compact size of 7 &x00D7; 7 mm<sup>2</sup>. Meanwhile, it achieves -10-dB impedance bandwidth from 33.4 to 37.2 GHz and a peak gain of 18.9 dBi at 35 GHz. Additionally, the impact of the package size on the antenna performance has been demonstrated for future AIA designers.
Description: 
URI: http://localhost/handle/Hannan/207806
volume: 16
More Information: 2416,
2419
Appears in Collections:2017

Files in This Item:
File SizeFormat 
7964664.pdf754.02 kBAdobe PDF
Title: A Compact Ka-Band Active Integrated Antenna With a GaAs Amplifier in a Ceramic Package
Authors: Yexi Song;Yunqiu Wu;Jie Yang;Yin Tian;Wei Tong;Yijun Chen;Cetian Wang;Xiaohong Tang;Johannes Benedikt;Kai Kang
Year: 2017
Publisher: IEEE
Abstract: This letter presents the design of a Ka-band active integrated antenna in package (AIAiP). A monolithic microwave integrated circuit amplifier based on the GaAs process and a compact patch antenna based on the printed circuit board process are implemented, respectively. Then, the amplifier and antenna are assembled together in a specified package using the wire-bond process. Thus, compared to the traditional solutions, the transmission loss and the size of the proposed AIAiP are significantly reduced. Furthermore, the influence of the bonding wire and the package is taken into account in the design of the amplifier and the antenna, respectively. A good agreement between the simulation and measurement results can be observed. The proposed AIAiP occupies a compact size of 7 &x00D7; 7 mm<sup>2</sup>. Meanwhile, it achieves -10-dB impedance bandwidth from 33.4 to 37.2 GHz and a peak gain of 18.9 dBi at 35 GHz. Additionally, the impact of the package size on the antenna performance has been demonstrated for future AIA designers.
Description: 
URI: http://localhost/handle/Hannan/207806
volume: 16
More Information: 2416,
2419
Appears in Collections:2017

Files in This Item:
File SizeFormat 
7964664.pdf754.02 kBAdobe PDF