Please use this identifier to cite or link to this item: http://localhost/handle/Hannan/148547
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dc.contributor.authorPing Lien_US
dc.contributor.authorYilin Dongen_US
dc.contributor.authorMin Tangen_US
dc.contributor.authorJunfa Maoen_US
dc.contributor.authorLi Jun Jiangen_US
dc.contributor.authorHakan Ba&x011F;c&x0131;en_US
dc.date.accessioned2013en_US
dc.date.accessioned2020-04-06T07:13:08Z-
dc.date.available2020-04-06T07:13:08Z-
dc.date.issued2017en_US
dc.identifier.other10.1109/TCPMT.2017.2666259en_US
dc.identifier.urihttp://localhost/handle/Hannan/148547-
dc.description.abstractSince accurate thermal analysis plays a critical role in the thermal design and management of the 3-D system-level integration, in this paper, a discontinuous Galerkin time-domain (DGTD) algorithm is proposed to achieve this purpose. Such as the parabolic partial differential equation (PDE), the transient thermal equation cannot be directly solved by the DGTD method. To address this issue, the heat flux, as an auxiliary variable, is introduced to reduce the Laplace operator to a divergence operator. The resulting PDE is hyperbolic, which can be further written into a conservative form. By properly choosing the definition of the numerical flux used for the information exchange between neighboring elements, the hyperbolic thermal PDE can be solved by the DGTD together with the auxiliary differential equation. The proposed algorithm is a kind of element-level domain decomposition method, which is suitable to deal with multiscale geometries in 3-D integrated systems. To verify the accuracy and robustness of the developed DGTD algorithm, several representative examples are benchmarked.en_US
dc.format.extent862,en_US
dc.format.extent871en_US
dc.publisherIEEEen_US
dc.relation.haspart7875407.pdfen_US
dc.titleTransient Thermal Analysis of 3-D Integrated Circuits Packages by the DGTD Methoden_US
dc.typeArticleen_US
dc.journal.volume7en_US
dc.journal.issue6en_US
Appears in Collections:2017

Files in This Item:
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7875407.pdf2.18 MBAdobe PDF
Full metadata record
DC FieldValueLanguage
dc.contributor.authorPing Lien_US
dc.contributor.authorYilin Dongen_US
dc.contributor.authorMin Tangen_US
dc.contributor.authorJunfa Maoen_US
dc.contributor.authorLi Jun Jiangen_US
dc.contributor.authorHakan Ba&x011F;c&x0131;en_US
dc.date.accessioned2013en_US
dc.date.accessioned2020-04-06T07:13:08Z-
dc.date.available2020-04-06T07:13:08Z-
dc.date.issued2017en_US
dc.identifier.other10.1109/TCPMT.2017.2666259en_US
dc.identifier.urihttp://localhost/handle/Hannan/148547-
dc.description.abstractSince accurate thermal analysis plays a critical role in the thermal design and management of the 3-D system-level integration, in this paper, a discontinuous Galerkin time-domain (DGTD) algorithm is proposed to achieve this purpose. Such as the parabolic partial differential equation (PDE), the transient thermal equation cannot be directly solved by the DGTD method. To address this issue, the heat flux, as an auxiliary variable, is introduced to reduce the Laplace operator to a divergence operator. The resulting PDE is hyperbolic, which can be further written into a conservative form. By properly choosing the definition of the numerical flux used for the information exchange between neighboring elements, the hyperbolic thermal PDE can be solved by the DGTD together with the auxiliary differential equation. The proposed algorithm is a kind of element-level domain decomposition method, which is suitable to deal with multiscale geometries in 3-D integrated systems. To verify the accuracy and robustness of the developed DGTD algorithm, several representative examples are benchmarked.en_US
dc.format.extent862,en_US
dc.format.extent871en_US
dc.publisherIEEEen_US
dc.relation.haspart7875407.pdfen_US
dc.titleTransient Thermal Analysis of 3-D Integrated Circuits Packages by the DGTD Methoden_US
dc.typeArticleen_US
dc.journal.volume7en_US
dc.journal.issue6en_US
Appears in Collections:2017

Files in This Item:
File SizeFormat 
7875407.pdf2.18 MBAdobe PDF
Full metadata record
DC FieldValueLanguage
dc.contributor.authorPing Lien_US
dc.contributor.authorYilin Dongen_US
dc.contributor.authorMin Tangen_US
dc.contributor.authorJunfa Maoen_US
dc.contributor.authorLi Jun Jiangen_US
dc.contributor.authorHakan Ba&x011F;c&x0131;en_US
dc.date.accessioned2013en_US
dc.date.accessioned2020-04-06T07:13:08Z-
dc.date.available2020-04-06T07:13:08Z-
dc.date.issued2017en_US
dc.identifier.other10.1109/TCPMT.2017.2666259en_US
dc.identifier.urihttp://localhost/handle/Hannan/148547-
dc.description.abstractSince accurate thermal analysis plays a critical role in the thermal design and management of the 3-D system-level integration, in this paper, a discontinuous Galerkin time-domain (DGTD) algorithm is proposed to achieve this purpose. Such as the parabolic partial differential equation (PDE), the transient thermal equation cannot be directly solved by the DGTD method. To address this issue, the heat flux, as an auxiliary variable, is introduced to reduce the Laplace operator to a divergence operator. The resulting PDE is hyperbolic, which can be further written into a conservative form. By properly choosing the definition of the numerical flux used for the information exchange between neighboring elements, the hyperbolic thermal PDE can be solved by the DGTD together with the auxiliary differential equation. The proposed algorithm is a kind of element-level domain decomposition method, which is suitable to deal with multiscale geometries in 3-D integrated systems. To verify the accuracy and robustness of the developed DGTD algorithm, several representative examples are benchmarked.en_US
dc.format.extent862,en_US
dc.format.extent871en_US
dc.publisherIEEEen_US
dc.relation.haspart7875407.pdfen_US
dc.titleTransient Thermal Analysis of 3-D Integrated Circuits Packages by the DGTD Methoden_US
dc.typeArticleen_US
dc.journal.volume7en_US
dc.journal.issue6en_US
Appears in Collections:2017

Files in This Item:
File SizeFormat 
7875407.pdf2.18 MBAdobe PDF