Novel Surface Impedance Modeling for Broadband Parameter Extraction of 3-D Interconnects

Abstract

A novel boundary integral equation based method for modeling 3-D interconnects is proposed to compute the equivalent surface impedance in this letter. Differing from the traditional algorithm to discretize the conductor cross section, the proposed method only discretizes the contour of the conductor cross section, thus reducing the CPU time and memory cost. The loss characteristics of conductors describing the skin effect are taken into account through Green's function. The equivalent surface impedance model can be used to simplify electromagnetic simulation only using electric field integral equation. Numerical results show that the proposed method is both efficient and accurate in a broadband frequency, which is suited for modeling of 3-D interconnects and integrated passive structures.