Please use this identifier to cite or link to this item: http://localhost/handle/Hannan/121521
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dc.contributor.authorYu Zhaoen_US
dc.contributor.authorFeng Lingen_US
dc.contributor.authorJunfa Maoen_US
dc.date.accessioned2013en_US
dc.date.accessioned2020-04-06T06:55:39Z-
dc.date.available2020-04-06T06:55:39Z-
dc.date.issued2017en_US
dc.identifier.other10.1109/LMWC.2016.2630842en_US
dc.identifier.urihttp://localhost/handle/Hannan/121521-
dc.description.abstractA novel boundary integral equation based method for modeling 3-D interconnects is proposed to compute the equivalent surface impedance in this letter. Differing from the traditional algorithm to discretize the conductor cross section, the proposed method only discretizes the contour of the conductor cross section, thus reducing the CPU time and memory cost. The loss characteristics of conductors describing the skin effect are taken into account through Green's function. The equivalent surface impedance model can be used to simplify electromagnetic simulation only using electric field integral equation. Numerical results show that the proposed method is both efficient and accurate in a broadband frequency, which is suited for modeling of 3-D interconnects and integrated passive structures.en_US
dc.format.extent7,en_US
dc.format.extent9en_US
dc.publisherIEEEen_US
dc.relation.haspart7797184.pdfen_US
dc.titleNovel Surface Impedance Modeling for Broadband Parameter Extraction of 3-D Interconnectsen_US
dc.typeArticleen_US
dc.journal.volume27en_US
dc.journal.issue1en_US
Appears in Collections:2017

Files in This Item:
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7797184.pdf593.98 kBAdobe PDF
Full metadata record
DC FieldValueLanguage
dc.contributor.authorYu Zhaoen_US
dc.contributor.authorFeng Lingen_US
dc.contributor.authorJunfa Maoen_US
dc.date.accessioned2013en_US
dc.date.accessioned2020-04-06T06:55:39Z-
dc.date.available2020-04-06T06:55:39Z-
dc.date.issued2017en_US
dc.identifier.other10.1109/LMWC.2016.2630842en_US
dc.identifier.urihttp://localhost/handle/Hannan/121521-
dc.description.abstractA novel boundary integral equation based method for modeling 3-D interconnects is proposed to compute the equivalent surface impedance in this letter. Differing from the traditional algorithm to discretize the conductor cross section, the proposed method only discretizes the contour of the conductor cross section, thus reducing the CPU time and memory cost. The loss characteristics of conductors describing the skin effect are taken into account through Green's function. The equivalent surface impedance model can be used to simplify electromagnetic simulation only using electric field integral equation. Numerical results show that the proposed method is both efficient and accurate in a broadband frequency, which is suited for modeling of 3-D interconnects and integrated passive structures.en_US
dc.format.extent7,en_US
dc.format.extent9en_US
dc.publisherIEEEen_US
dc.relation.haspart7797184.pdfen_US
dc.titleNovel Surface Impedance Modeling for Broadband Parameter Extraction of 3-D Interconnectsen_US
dc.typeArticleen_US
dc.journal.volume27en_US
dc.journal.issue1en_US
Appears in Collections:2017

Files in This Item:
File SizeFormat 
7797184.pdf593.98 kBAdobe PDF
Full metadata record
DC FieldValueLanguage
dc.contributor.authorYu Zhaoen_US
dc.contributor.authorFeng Lingen_US
dc.contributor.authorJunfa Maoen_US
dc.date.accessioned2013en_US
dc.date.accessioned2020-04-06T06:55:39Z-
dc.date.available2020-04-06T06:55:39Z-
dc.date.issued2017en_US
dc.identifier.other10.1109/LMWC.2016.2630842en_US
dc.identifier.urihttp://localhost/handle/Hannan/121521-
dc.description.abstractA novel boundary integral equation based method for modeling 3-D interconnects is proposed to compute the equivalent surface impedance in this letter. Differing from the traditional algorithm to discretize the conductor cross section, the proposed method only discretizes the contour of the conductor cross section, thus reducing the CPU time and memory cost. The loss characteristics of conductors describing the skin effect are taken into account through Green's function. The equivalent surface impedance model can be used to simplify electromagnetic simulation only using electric field integral equation. Numerical results show that the proposed method is both efficient and accurate in a broadband frequency, which is suited for modeling of 3-D interconnects and integrated passive structures.en_US
dc.format.extent7,en_US
dc.format.extent9en_US
dc.publisherIEEEen_US
dc.relation.haspart7797184.pdfen_US
dc.titleNovel Surface Impedance Modeling for Broadband Parameter Extraction of 3-D Interconnectsen_US
dc.typeArticleen_US
dc.journal.volume27en_US
dc.journal.issue1en_US
Appears in Collections:2017

Files in This Item:
File SizeFormat 
7797184.pdf593.98 kBAdobe PDF