مرور بر اساس تاریخ انتشار Yilin Dong

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PreviewIssue DateTitleContributor(s)
2017Transient Thermal Analysis of 3-D Integrated Circuits Packages by the DGTD MethodPing Li; Yilin Dong; Min Tang; Junfa Mao; Li Jun Jiang; Hakan Ba&x011F;c&x0131;