مرور بر اساس تاریخ انتشار Yilin Dong
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| Preview | Issue Date | Title | Contributor(s) |
|---|---|---|---|
| 2017 | Transient Thermal Analysis of 3-D Integrated Circuits Packages by the DGTD Method | Ping Li; Yilin Dong; Min Tang; Junfa Mao; Li Jun Jiang; Hakan Ba&x011F;c&x0131; |