مرور بر اساس تاریخ انتشار Suresh K. Sitaraman

Showing results 1 to 8 of 8
PreviewIssue DateTitleContributor(s)
7406673.pdf.jpg2016Area-Array of 3-Arc-Fan Compliant Interconnects as Effective Drop-Impact Isolator for MicrosystemsWei Chen; Suresh K. Sitaraman
2017Experimental and Theoretical Assessment of Thin Glass Substrate for Low WarpageScott McCann; Vanessa Smet; Venky Sundaram; Rao R. Tummala; Suresh K. Sitaraman
7389346.pdf.jpg2016Experimental Stress Characterization and Numerical Simulation for Copper Pumping Analysis of Through-Silicon ViasXi Liu; Paragkumar A. Thadesar; Christine L. Taylor; Martin Kunz; Nobumichi Tamura; Muhannad S. Bakir; Suresh K. Sitaraman
7546873.pdf.jpg2016Experiments for Obtaining Cohesive-Zone Parameters for Copper-Mold Compound Interfacial DelaminationWilliam E. R. Krieger; Sathyanarayanan Raghavan; Suresh K. Sitaraman
2017Integrated Circuit Cooling Using Heterogeneous Micropin-Fin Arrays for Nonuniform Power MapsThomas E. Sarvey; Yuanchen Hu; Craig E. Green; Peter A. Kottke; David C. Woodrum; Yogendra K. Joshi; Andrei G. Fedorov; Suresh K. Sitaraman; Muhannad S. Bakir
7353139.pdf.jpg2016Prevention of Cracking From RDL Stress and Dicing Defects in Glass SubstratesScott McCann; Yoichiro Sato; Venkatesh Sundaram; Rao R. Tummala; Suresh K. Sitaraman
7579230.pdf.jpg2016Process Innovations to Prevent Glass Substrate Fracture From RDL Stress and Singulation DefectsScott McCann; Bhupender Singh; Vanessa Smet; Venkatesh Sundaram; Rao R. Tummala; Suresh K. Sitaraman
2017Use of Birefringence to Determine Redistribution Layer Stresses to Create Design Guidelines to Prevent Glass CrackingScott McCann; Yoichiro Sato; Tomo Ogawa; Rao R. Tummala; Suresh K. Sitaraman