مرور بر اساس تاریخ انتشار Paragkumar A. Thadesar

Showing results 1 to 4 of 4
PreviewIssue DateTitleContributor(s)
7389346.pdf.jpg2016Experimental Stress Characterization and Numerical Simulation for Copper Pumping Analysis of Through-Silicon ViasXi Liu; Paragkumar A. Thadesar; Christine L. Taylor; Martin Kunz; Nobumichi Tamura; Muhannad S. Bakir; Suresh K. Sitaraman
7393822.pdf.jpg2016Fabrication and Characterization of Polymer-Enhanced TSVs, Inductors, and Antennas for Mixed-Signal Silicon Interposer PlatformsParagkumar A. Thadesar; Muhannad S. Bakir
7419825.pdf.jpg2016Low-Loss Air-Isolated Through-Silicon Vias for Silicon InterposersHanju Oh; Paragkumar A. Thadesar; Gary S. May; Muhannad S. Bakir
7428885.pdf.jpg2016Through-Silicon Vias: Drivers, Performance, and InnovationsParagkumar A. Thadesar; Xiaoxiong Gu; Ramakanth Alapati; Muhannad S. Bakir
Showing results 1 to 4 of 4