مرور بر اساس تاریخ انتشار Muhannad S. Bakir

Showing results 1 to 18 of 18
PreviewIssue DateTitleContributor(s)
7406750.pdf.jpg2016Analysis of Signal Propagation Through TSVs Within Distilled Water for Liquid-Cooled MicrosystemsHanju Oh; Gary S. May; Muhannad S. Bakir
2017Circular Waveguide Grating-Via-Grating for Interlayer CouplingCongshan Wan; Thomas K. Gaylord; Muhannad S. Bakir
2017Design, Fabrication, and Characterization of Dense Compressible MicrointerconnectsPaul K. Jo; Muneeb Zia; Joe L. Gonzalez; Hanju Oh; Muhannad S. Bakir
7389346.pdf.jpg2016Experimental Stress Characterization and Numerical Simulation for Copper Pumping Analysis of Through-Silicon ViasXi Liu; Paragkumar A. Thadesar; Christine L. Taylor; Martin Kunz; Nobumichi Tamura; Muhannad S. Bakir; Suresh K. Sitaraman
7393822.pdf.jpg2016Fabrication and Characterization of Polymer-Enhanced TSVs, Inductors, and Antennas for Mixed-Signal Silicon Interposer PlatformsParagkumar A. Thadesar; Muhannad S. Bakir
7514288.pdf.jpg2016Foreword: Special Section on 3-D IntegrationMuhannad S. Bakir; Ravi Mahajan
7401032.pdf.jpg2016Full-Chip Power Supply Noise Time-Domain Numerical Modeling and Analysis for Single and Stacked ICsLi Zheng; Yang Zhang; Muhannad S. Bakir
2017Heterogeneous Integrated Microsystems With Nontraditional Through-Silicon Via TechnologiesHanju Oh; Gary S. May; Muhannad S. Bakir
2017Heterogeneous Interconnect Stitching Technology With Compressible MicroInterconnects for Dense Multi-Die IntegrationXuchen Zhang; Paul K. Jo; Muneeb Zia; Gary S. May; Muhannad S. Bakir
7466080.pdf.jpg2016Impact of On-Chip Interconnect on the Performance of 3-D Integrated Circuits With Through Silicon Vias: Part IVachan Kumar; Hanju Oh; Xuchen Zhang; Li Zheng; Muhannad S. Bakir; Azad Naeemi
7466858.pdf.jpg2016Impact of On-Chip Interconnect on the Performance of 3-D Integrated Circuits With Through-Silicon Vias: Part IIXuchen Zhang; Vachan Kumar; Hanju Oh; Li Zheng; Gary S. May; Azad Naeemi; Muhannad S. Bakir
2017Integrated Circuit Cooling Using Heterogeneous Micropin-Fin Arrays for Nonuniform Power MapsThomas E. Sarvey; Yuanchen Hu; Craig E. Green; Peter A. Kottke; David C. Woodrum; Yogendra K. Joshi; Andrei G. Fedorov; Suresh K. Sitaraman; Muhannad S. Bakir
2017Integrated Thermal and Power Delivery Network Co-Simulation Framework for Single-Die and Multi-Die AssembliesYang Zhang; Muhannad S. Bakir
7419825.pdf.jpg2016Low-Loss Air-Isolated Through-Silicon Vias for Silicon InterposersHanju Oh; Paragkumar A. Thadesar; Gary S. May; Muhannad S. Bakir
7707391.pdf.jpg2016Mechanically Flexible Interconnects With Contact Tip for Rematable Heterogeneous System IntegrationChaoqi Zhang; Hyung Suk Yang; Hiren D. Thacker; Ivan Shubin; John E. Cunningham; Muhannad S. Bakir
2017Monolithic Integration of a Micropin-Fin Heat Sink in a 28-nm FPGAThomas E. Sarvey; Yang Zhang; Colman Cheung; Ravi Gutala; Arifur Rahman; Aravind Dasu; Muhannad S. Bakir
7961212.pdf.jpg2017Thermal Evaluation of 2.5-D Integration Using Bridge-Chip Technology: Challenges and OpportunitiesYang Zhang; Thomas E. Sarvey; Muhannad S. Bakir
7428885.pdf.jpg2016Through-Silicon Vias: Drivers, Performance, and InnovationsParagkumar A. Thadesar; Xiaoxiong Gu; Ramakanth Alapati; Muhannad S. Bakir