Please use this identifier to cite or link to this item: http://localhost/handle/Hannan/558395
Title: Signal Processing Letters, IEEE
Authors: Siping Wang ; Wen-Chien Chen ; Bahr, Bichoy ; Weileun Fang ; Sheng-Shian Li ; Weinstein, Dana
subject: CMOS integrated circuits; acoustic resonators; bulk acoustic wave devices; composite material interfaces; micromechanical resonators; CMOS-MEMS bulk mode composite material resonators; embedded metal block; frequency modeling; mode shape; simulation packages; subppm temperature stability; temperature coefficient; temperature compensation; Analytical models; Metals; Micromechanical devices; Resonant frequency; Strain; Temperature; Thermal stability;
Year: 2015
Publisher: ieee
Description: Dept. of Electr. Eng. & Comput. Sci., Massachusetts Inst. of Technol., Cambridge, MA, USA
URI: http://localhost/handle/Hannan/209388
http://localhost/handle/Hannan/558395
ISSN: 0885-3010
volume: 62
issue: 6
Appears in Collections:2015

Files in This Item:
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Title: Signal Processing Letters, IEEE
Authors: Siping Wang ; Wen-Chien Chen ; Bahr, Bichoy ; Weileun Fang ; Sheng-Shian Li ; Weinstein, Dana
subject: CMOS integrated circuits; acoustic resonators; bulk acoustic wave devices; composite material interfaces; micromechanical resonators; CMOS-MEMS bulk mode composite material resonators; embedded metal block; frequency modeling; mode shape; simulation packages; subppm temperature stability; temperature coefficient; temperature compensation; Analytical models; Metals; Micromechanical devices; Resonant frequency; Strain; Temperature; Thermal stability;
Year: 2015
Publisher: ieee
Description: Dept. of Electr. Eng. & Comput. Sci., Massachusetts Inst. of Technol., Cambridge, MA, USA
URI: http://localhost/handle/Hannan/209388
http://localhost/handle/Hannan/558395
ISSN: 0885-3010
volume: 62
issue: 6
Appears in Collections:2015

Files in This Item:
File Description SizeFormat 
7119997.pdf6.39 MBAdobe PDFThumbnail
Preview File
Title: Signal Processing Letters, IEEE
Authors: Siping Wang ; Wen-Chien Chen ; Bahr, Bichoy ; Weileun Fang ; Sheng-Shian Li ; Weinstein, Dana
subject: CMOS integrated circuits; acoustic resonators; bulk acoustic wave devices; composite material interfaces; micromechanical resonators; CMOS-MEMS bulk mode composite material resonators; embedded metal block; frequency modeling; mode shape; simulation packages; subppm temperature stability; temperature coefficient; temperature compensation; Analytical models; Metals; Micromechanical devices; Resonant frequency; Strain; Temperature; Thermal stability;
Year: 2015
Publisher: ieee
Description: Dept. of Electr. Eng. & Comput. Sci., Massachusetts Inst. of Technol., Cambridge, MA, USA
URI: http://localhost/handle/Hannan/209388
http://localhost/handle/Hannan/558395
ISSN: 0885-3010
volume: 62
issue: 6
Appears in Collections:2015

Files in This Item:
File Description SizeFormat 
7119997.pdf6.39 MBAdobe PDFThumbnail
Preview File