Please use this identifier to cite or link to this item: http://localhost/handle/Hannan/454363
Title: A physical model of time-dependent dielectric breakdown in copper metallization
Authors: Wa, Wen;Duan, Xiaodong;Yuan, J. S.
subject: "E" model;Copper diffusion;Copper metallization;Reliability;TDDB lifetime
Year: 2008
Description: 

URI: http://localhost/handle/Hannan/455496
http://localhost/handle/Hannan/454363
ISSN: 780376498
Appears in Collections:2002-2008

Files in This Item:
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AL367521.pdf289.79 kBAdobe PDF
Title: A physical model of time-dependent dielectric breakdown in copper metallization
Authors: Wa, Wen;Duan, Xiaodong;Yuan, J. S.
subject: "E" model;Copper diffusion;Copper metallization;Reliability;TDDB lifetime
Year: 2008
Description: 

URI: http://localhost/handle/Hannan/455496
http://localhost/handle/Hannan/454363
ISSN: 780376498
Appears in Collections:2002-2008

Files in This Item:
File SizeFormat 
AL367521.pdf289.79 kBAdobe PDF
Title: A physical model of time-dependent dielectric breakdown in copper metallization
Authors: Wa, Wen;Duan, Xiaodong;Yuan, J. S.
subject: "E" model;Copper diffusion;Copper metallization;Reliability;TDDB lifetime
Year: 2008
Description: 

URI: http://localhost/handle/Hannan/455496
http://localhost/handle/Hannan/454363
ISSN: 780376498
Appears in Collections:2002-2008

Files in This Item:
File SizeFormat 
AL367521.pdf289.79 kBAdobe PDF